Additive manufacturing of active devices using dielectric, conductive and magnetic materials
US10254499B1 · kind B1 · utility
274Cited by
2References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 4, 2017 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Aug 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8592
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a process, system and apparatus for multi-material additive manufacturing process comprising: extruding an extrudable material through a nozzle capable of moving along one or more axis and concurrently extruding one or more filaments, wherein the filament is embedded in, on or about the extrudable material from the nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.