Light emitting device package
US10256218B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Mar 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device package includes: a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip to form a flip-chip structure; a plurality of wirings directly connected to the electrodes of the chips, respectively; a plurality of electrode pads disposed below the chips and directly connected to the wirings, respectively; and a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance, wherein the wirings are disposed below a lower surface of the molding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.