Modification of surface energy via direct laser ablative surface patterning
US10259077B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Mar 24, 2015 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | May 24, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Surface energy of a substrate is changed without the need for any template, mask, or additional coating medium applied to the substrate. At least one beam of energy directly ablates a substrate surface to form a predefined topographical pattern at the surface. Each beam of energy has a width of approximately 25 micrometers and an energy of approximately 1-500 microJoules. Features in the topographical pattern have a width of approximately 1-500 micrometers and a height of approximately 1.4-100 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.