Solventless laminating adhesive for flexible packaging laminations and laminated structures made with the adhesive
US10259200B2 · kind B2 · utility
1Cited by
6References
4Claims
0Family size
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Inventor
Key dates
| Filing date | Jun 29, 2011 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Jun 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Two-component solventless adhesive compositions for lamination applications and laminated structures, including flexible laminated packaging, comprising at least two substrates, including structures comprising reverse printed ink films and/or metalized films. The adhesive comprises a prepolymer having one or more oligomers with a relatively high molecular weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.