Heat modulating food packaging material
US10259638B2 · kind B2 · utility
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1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Dec 30, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B40/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An oven may include a cooking chamber configured to receive a heat modulating material (HMM), a radio frequency (RF) heating system configured to provide RF energy into the cooking chamber, and a cooking controller configured to control the frequency of RF energy provided by the RF heating system into the cooking chamber. The MINI may be configured to contain a food product and may include a thermally active section. The thermally active section may include a base matrix and a particulate material dispersed in the base matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.