Heat dissipation in hermetically-sealed packaged devices
US10260782B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | May 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/13
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.