Analyzing apparatus, analyzing method, and computer program
US10262086B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Nov 12, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/23
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An analyzing apparatus generates first displacement distribution data indicating a displacement distribution of a member caused by springback based on finite element model data, material physical property data, and stress distribution data; generates second displacement distribution data indicating an amount of displacement of the member in each of a plurality of, for example, all, natural vibration deformation modes based on the finite element model data and the material physical property data; obtains a degree of coincidence between the first displacement distribution data and each of the second displacement distribution data, and selects one or more natural vibration deformation modes based on the degree of coincidence, to determine a modified shape in which natural vibrations are increased, thereby bringing the member closer to a target shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.