Multilayer ceramic electronic component including ceramic-metal compound layers
US10262795B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 16, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Jul 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.