Patent · US Active

Deposition system with integrated cooling on a rotating drum

US10262838B2 · kind B2 · utility

1Cited by
7References
29Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 21, 2016
Grant dateApr 16, 2019
Priority date
Expiry dateOct 21, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/3321
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

In one aspect, a system of depositing a film on a substrate is disclosed, which includes at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive ionic species. The system further includes a pair of inner and outer concentric cylinders, where the outer cylinder has first and second openings positioned relative to the metallization source and the reactive source to allow entry of the metal atoms and the reactive ionic species into a metallization region and a reaction region, respectively, between the two cylinders. At least one mount is coupled to the inner cylinder for mounting the substrate thereto such that said substrate is in radiative thermal communication with the inner surface of the outer cylinder, said inner cylinder being rotatable for moving the substrate between the two regions so as to expose the substrate alternatingly to said metal atoms and said reactive ionic species. Further, the outer cylinder includes at least one cooling channel through which a cooling fluid can flow for maintaining the inner surface of the outer cylinder at a temperature suitable for radiative cooling of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.