Method of producing a functional inlay and inlay produced by the method
US10262906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2014 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Dec 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/04042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of manufacturing a functional inlay, comprises at least the steps of: (1) providing a substrate with a wire antenna embedded therein and with an aperture wherein two wire antenna portions are positioned over said aperture; (2) acquiring the positions and the dimensions of said wire antenna portions and of said aperture; (3) determining if the acquired positions and dimensions meet predetermined tolerances; (4) if the acquired dimensions and positions meet said tolerances, then placing a chip in fie aperture so that said wire portions are positioned over connections pads of said chip and then bonding said wire portions to said connection pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.