Radiation hardened microelectronic chip packaging technology
US10262951B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
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Key dates
| Filing date | May 16, 2014 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | May 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and mulitlayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.