Optical integrated circuit systems, devices, and methods of fabrication
US10262984B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2018 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Jul 5, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12123
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical integrated circuit device includes an electrically insulating substrate, an optical connection disposed at a boundary of the optical integrated circuit, and a first electrostatic discharge (ESD) protection structure in direct contact with and electrically coupled to the first waveguide. The optical connection includes a first waveguide. The first waveguide is disposed on the electrically insulating substrate and configured to transmit an optical signal. The first ESD protection structure is both electrically non-insulating and substantially optically transparent to the optical signal. An ESD diode including an anode and a cathode is electrically coupled to the first ESD protection structure. A ground connection is electrically coupled to the anode of the ESD diode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.