Integrated RF front end system
US10263072B2 · kind B2 · utility
1Cited by
34References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Oct 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.