Electronic component including a material comprising epdxysilane-modified polyorganosiloxane
US10263164B2 · kind B2 · utility
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4References
18Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 4, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Feb 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.