Optoelectronic component and method for producing an optoelectronic component

US10263214B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Nina Riegel · Tegernheim, DE
• Sebastian Wittmann · Regensburg, DE
• Erwin Lang · Regensburg, DE
• Arne Fleissner · Regensburg, DE

Key dates

• Filing date: Nov 28, 2017
• Grant date: Apr 16, 2019
• Expiry date: Dec 3, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K77/111

Abstract

In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.