Modularized feed array arrangement
US10263325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Dec 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A modularized feed array arrangement includes a plurality of radio frequency (RF) radiating elements, a plurality of waveguides positioned inboard of the plurality of RF radiating elements, each RF radiating element being electrically coupled with an outboard portion of one or more of the waveguides; and a plurality of modules, each module including a plurality of RF switches, a plurality of amplifiers, and a manifold panel that includes a plurality of RF choke joints. An inboard portion of each RF switch is electrically coupled with a respective amplifier. Each RF choke joint includes a proximal portion electrically coupled with an outboard portion of a respective one of the RF switches and a distal portion electrically coupled with an inboard portion of a respective one of the waveguides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.