System and method for active cooling of on-machine devices
US10263497B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Jan 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K9/223
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system and method for cooling an enclosed position feedback device mounted to a motor is disclosed. An active cooling device is mounted between the position feedback device and the housing enclosing the position feedback device. A compliant mount is provided to accommodate vibration in the position feedback device. The compliant mount may be a compliant thermal pad positioned between the feedback device and the active cooling device. Optionally, the compliant mount may be provided between the motor and the position feedback device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.