Multi-chip millimeter-wave interface
US10263652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Jun 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6683
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for millimeter-wave (MMW) communication, the system includes a transceiver chip to generate and to receive signals. An interface is used to communicate the signals between the transceiver chip and one or more active antenna modules. The signals include modulated MMW signals and control signals. The transceiver chip includes baseband circuitry, up and down conversion mixers, and RF front-end circuitry. An active antenna module receives a first modulated MMW signal from the interface for transmission via antennas and to receive a second modulated MMW signal from the antennas for transmission through the interface to the transceiver chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.