Microfluidic delivery system with a die on a rigid substrate
US10264667B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 20, 2014 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Apr 5, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/6416
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.