Component vertical mounting
US10264668B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Oct 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/17
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.