Flexible electronic assemblies with embedded electronic devices and methods for their fabrication
US10264669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Jun 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.