Heat dissipating structure
US10264703B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 18, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | May 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/047
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating structure generally utilized in a telecommunication product includes a plurality of PCB modules, a metal framework, a top lid, and a perforated panel. The heat dissipating structure is generally utilized in a telecommunication product. The plurality of PCB modules are coupled in series and configured to form a chassis. The metal framework is housed within the chassis and forms an internal chamber. The top lid is disposed at a top side of the heat dissipating structure. The perforated panel is disposed below the top lid and over the internal chamber. The perforated panel includes a plurality of ventilation holes. The internal chamber cooperates with the plurality of ventilation holes to dissipate heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.