Binderless metal injection molding apparatus and method
US10265770B2 · kind B2 · utility
2Cited by
7References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2014 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | May 14, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metal injection molding apparatus includes a metal injection mold die having first and second die halves, a first set of features provided in the first die half, a second set of features provided in the second die half and complementary to the first set of features provided in the first are half and an ultrasonic transducer disposed in contact with the metal injection mold die. A binderless metal injection molding method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.