Method of forming a recess in a substrate
US10265826B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2014 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | May 20, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C19/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming a recess in a surface of a substrate includes: providing an abrasive article comprising a structured abrasive member disposed along a peripheral surface of a support member, frictionally contacting the structured abrasive layer with a surface of a substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and rotating at least one of the abrasive article or the substrate relative to the other around a rotational axis perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate. The structured abrasive member comprises a structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member. The shaped abrasive composites comprise abrasive particles retained in a binder material. The present disclosure also provides an abrasive wheel comprises a structured abrasive member disposed on a peripheral surface of a support wheel and display covers including a spherically concave recess abutting a cylindrical passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.