Incorporation of active particles into substrates
US10266986B2 · kind B2 · utility
5Cited by
5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 2015 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Jan 1, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249921
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An active particle bonding system comprising an active particle, a material chemically bonded to the active particle, and a substrate embedded to at least one of the active particle and the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.