In-plane active cooling device for mobile electronics
US10267545B2 · kind B2 · utility
1Cited by
3References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2016 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Apr 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/17
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.