Prestructured substrate for the production of photonic components, associated photonic circuit and manufacturing method
US10267989B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2015 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Oct 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate locally pre-structured for the production of photonic components including a solid part made of silicon; a first localised region of the substrate, including a heat dissipation layer, produced in a localised manner on the surface of the solid part and made of a material of which the refractive index is less than that of silicon; a wave guide on the heat dissipation layer; a second localised region of the substrate, including an oxide layer produced in a localised manner on the surface of the solid part, the oxide having a heat conductivity less than that of the material of the heat dissipation layer; a wave guide on the oxide layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.