High-resolution electric field sensor in cover glass
US10268864B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2016 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Jul 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/87
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor is described that includes a thin protective cover layer on a sensor glass layer with receive circuitry between the thin protective cover layer and the sensor glass layer. In an implementation, a fingerprint sensor assembly includes a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the controller; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the controller; and a protective cover layer disposed on the receive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.