Method for forming an electrical device and electrical devices
US10269695B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2017 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Jul 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92125
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.