Flex circuit for accessing pins of a chip carrier
US10269696B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2015 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Jun 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Flexible circuits mountable in a standoff region between a chip carrier, e.g., a ball grid array (BGA) component, and a printed circuit board (PCB) of a surface-mount package are described. In an example, a flexible circuit includes holes to receive pins, e.g., solder balls, of the BGA component, and one or more conductive leads electrically connected to respective solder balls within the holes. The conductive leads may interconnect several solder balls within the standoff region, and may be electrically accessible through a test pad located laterally outward from the standoff region. Electrical signals may be monitored or driven through the test pad, and thus, the flexible circuit may be used as a debug tool for detecting and or correcting a design fault of the surface-mount package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.