Semiconductor package and method of manufacturing the same
US10269725B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Jun 27, 2017 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Jun 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.