Power electronic switching device, arrangement herewith and methods for producing the switching device

US10269755B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Harald Kobolla · Seukendorf, DE
• Jörg Ammon · Erlangen, DE

Key dates

• Filing date: Jul 24, 2017
• Grant date: Apr 23, 2019
• Expiry date: Nov 8, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73267
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A switching device has a substrate, a power semiconductor component arranged thereon, a connection device and a pressure device. The substrate has conductor tracks electrically insulated from each another. A power semiconductor component is arranged on one of the conductor tracks. The connection device is embodied as a film composite having an electrically conductive film and an electrically insulating film and forming a first and a second main surface. The switching device is connected in a circuit-conforming manner by the connection device, and a contact area of the first main surface of the power semiconductor component is connected to a first contact area of an assigned conductor track of the substrate in a force-locking and electrically conductive manner.