Server system
US10271460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2016 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Apr 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A server system includes an enclosure, a first section, a motherboard section, a fan section, and a midplane board. The first section is disposed at a first end of the enclosure and includes at least one heat generating component. The motherboard section is disposed at a second end of the enclosure and includes at least one motherboard. The fan section is disposed between the front section and the motherboard section and includes at least one fan for directing air in from the first end and out of the second end. The midplane board is vertically interposed between the fan section and the motherboard section, and is configured to electrically and communicatively couple the at least one motherboard to one or more components in the first section, and includes one or more airflow cutouts. The one or more airflow cutouts of the midplane board make up at least thirty percent of a cross-sectional surface area of the midplane board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.