Down product having joining pattern line produced by high-frequency bonding technique and method for manufacturing same
US10271599B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 1, 2015 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Jul 1, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2437/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process of manufacturing a down product comprises at least one bonding pattern line for the compartment separation without forming sewing holes by printing and drying a heat-reactive adhesive on the inner surface of an inner fabric, an optional mesh material and/or an outer fabric in a predetermined pattern, laminating said inner fabric, optional mesh material and/or outer fabric, and then high-frequency heating them under pressing with a pressing pattern the same as the printing pattern to bond the inner fabric, optional mesh material and outer fabric. Accordingly, it is possible to manufacture a down product having a bonding pattern line composed of a bonding line with excellent adhesiveness and durability and an aesthetically excellent pattern line with good clearness and finishing quality as well as to achieve a mass production of down products by mechanization and automation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.