Hermetic terminal for an active implantable medical device with composite co-fired filled via and body fluid side brazed leadwire
US10272253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Oct 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B17/303
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.