MEMS device, liquid ejecting head, manufacturing method of MEMS device, and manufacturing method of liquid ejecting head
US10272686B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Jul 19, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/18
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.