Patent · US Active

Repair compound and methods of use

US10273185B2 · kind B2 · utility

2Cited by

15References

45Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

John E. Gozum · Stillwater, US
Danli Wang · Shoreview, US
Dwight B. Schoenherr · Stillwater, US

Key dates

Filing date	Jun 10, 2015
Grant date	Apr 30, 2019
Priority date	—
Expiry date	Aug 14, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02W30/91
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.