Stress manipulated coating for figure reshape of optical substrates
US10274644B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Nov 27, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A deposition system for forming a stress distributed coating layer is provided which comprises a deposition apparatus comprising a source from which a coating material emanates, the source configured to restrict a flux of the coating material towards a backside of an optical substrate; a holder configured to hold the optical substrate; a drive system configured to provide relative translation of the source and the optical substrate; and a bias voltage power supply operably coupled to the source and the optical substrate and configured to apply a bias voltage between the source and the backside of the optical substrate. A device is operably coupled to the deposition apparatus, the device comprising a processor; and a computer-readable medium operably coupled to the processor, the computer-readable medium having computer-readable instructions stored thereon that, when executed by the processor, cause the deposition apparatus to deposit the coating material onto the backside of the optical substrate and to adjust the bias voltage between the source and the backside of the optical substrate during the deposition of the coating material as a function of relative position of the source a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.