Highly integrated multi-channel optical transceiver module and active optical cable based on silicon photonic chip
US10274687B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 17, 2018 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Jan 17, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0157
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding. The present invention provides a high-data-rate, low-power-consumption, and cost-effective solution for optical transceiver modules and active optical cables based on silicon photonic chip technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.