Patent · US Active

Silicon wafer pre-alignment device and method therefor

US10276418B2 · kind B2 · utility

1Cited by

1References

16Claims

0Family size

Assignee

SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD · CN

Inventors

Weiwang Sun · Shanghai, CN
Gang Wang · Beijing, CN
Chunxia Huang · Shanghai, CN
Songli Hu · Shanghai, CN
Jie Jiang · Shanghai, CN
Ruzhan Lu · Shanghai, CN
Jiyuan Mou · Shanghai, CN

Key dates

Filing date	Dec 26, 2014
Grant date	Apr 30, 2019
Priority date	—
Expiry date	Sep 28, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/22
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.