Semiconductor device and method for manufacturing the same
US10276463B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Oct 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate with a recess subsiding from a selected surface of the substrate to accommodate a semiconductor element. Connected to the semiconductor element, an electroconductive portion extends from the recess onto the selected surface. A post, formed at the selected surface, has a first surface in contact with the electroconductive portion, a second surface, and a side surface between the first and second surfaces. A sealing resin covers the side surface of the post and the semiconductor element, and has a mounting surface facing in the same direction as the selected surface of the substrate. A pad, on the mounting surface of the sealing resin, is in contact with the second surface of the post. In the thickness direction, the second surface of the post is offset from the mounting surface of the sealing resin toward the selected surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.