Method for reinforcing conductor tracks of a circuit board
US10276482B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2015 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Aug 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.