Power module
US10276522B2 · kind B2 · utility
3Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2015 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Oct 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.