Mechanically flexible and durable substrates and method of making
US10276811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2016 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Aug 9, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.