Method for fabricating an electromagnetic induction digitizer antenna board
US10276935B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Nov 3, 2016 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Apr 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B5/26
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an electromagnetic induction digitizer antenna board that includes the steps of: a. preparing a substrate that is convenient for being holed; b. providing a consecutive wire leading-out terminal at one side of the substrate; c. moving the substrate relative to the consecutive wire leading-out terminal along with a predetermined track of the electromagnetic induction coil of the induction digitizer antenna board, so that the consecutive wire leading-out terminal gets in surface-contact with the substrate, and configures the electromagnetic induction coil on the substrate; d. binding the conductive wire of the electromagnetic induction coil with the substrate at every predetermined interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.