Ejectable component assemblies in electronic devices

US10277722B2 · kind B2 · utility

Assignee

• Apple Inc. · US

Inventors

• Erik L. Wang · Cupertino, US
• Robert Sean Murphy · Sunnyvale, US
• Tang Yew Tan · San Francisco, US
• Jeffrey Eugene Neaves · Duluth, US
• Lawrence E. Davis · Boynton Beach, US
• Sung Hoon Kim · Seoul, KR

Key dates

• Filing date: Sep 23, 2016
• Grant date: Apr 30, 2019
• Expiry date: Sep 23, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04M2250/14
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.