Reduced-damping acoustic holes
US10277979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2016 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | May 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/15
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and apparatuses for a MEMS device. The MEMS device includes a diaphragm and a backplate spaced a distance from the diaphragm forming an air gap therebetween. The backplate includes a first surface facing toward the diaphragm and an opposing second surface facing away from the diaphragm. The first surface and the opposing second surface of the backplate cooperatively define a plurality of through-holes that extend through the backplate allowing air from the air gap to flow therethrough. Each of the plurality of through-holes include a first aperture disposed along the first surface, a second aperture disposed along the opposing second surface, and a sidewall extending between the first surface and the opposing second surface. The first aperture and the second aperture have different dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.