Three dimensional packaging for medical implants
US10279085B2 · kind B2 · utility
0Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2014 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Aug 13, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Implantable medical devices, and methods of coating same, including a plurality of components disposed on a substrate, and a low surface energy layer deposited as a liquid over at least a first portion of the components and the substrate, the low surface energy layer becoming solidified after deposition and conforming to at least the first portion of the components. The devices further include a biocompatible hermetic coating conforming to and sealingly covering at least a portion of the low surface energy layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.