Patent · US Active

Polycrystalline compacts including diamond nanoparticles, cutting elements and earth- boring tools including such compacts, and methods of forming same

US10279454B2 · kind B2 · utility

11Cited by
11References
12Claims
0Family size

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Key dates

Filing dateMar 15, 2013
Grant dateMay 7, 2019
Priority date
Expiry dateOct 13, 2034

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2235/5454
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A polycrystalline compact includes a plurality of diamond grains of micron size, submicron size, or both, and a plurality of diamond nanoparticles disposed in interstitial spaces between the plurality of diamond grains. A method of forming a polycrystalline compact includes combining a plurality of micron and/or submicron-sized diamond grains and a plurality of diamond nanoparticles to form a mixture and sintering the mixture in a presence of a carburized binder to form a polycrystalline hard material having a plurality of inter-bonded diamond grains and diamond nanoparticles. Cutting elements including a polycrystalline compact and earth-boring tools bearing such compacts are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.