Polycrystalline compacts including diamond nanoparticles, cutting elements and earth- boring tools including such compacts, and methods of forming same
US10279454B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Oct 13, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/5454
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A polycrystalline compact includes a plurality of diamond grains of micron size, submicron size, or both, and a plurality of diamond nanoparticles disposed in interstitial spaces between the plurality of diamond grains. A method of forming a polycrystalline compact includes combining a plurality of micron and/or submicron-sized diamond grains and a plurality of diamond nanoparticles to form a mixture and sintering the mixture in a presence of a carburized binder to form a polycrystalline hard material having a plurality of inter-bonded diamond grains and diamond nanoparticles. Cutting elements including a polycrystalline compact and earth-boring tools bearing such compacts are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.