Method for manufacturing structure
US10279589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2017 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Oct 28, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14467
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X≥30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.